Display device and method of fabricating the same

ABSTRACT

A display device includes: a curved first substrate; a second substrate opposing the first substrate; a plurality of connection pads disposed on a side surface of the first substrate and a side surface of the second substrate; and at least one flexible circuit board including a plurality of projections respectively coupled to the plurality of connection pads, wherein the plurality of projections forms an array of projections along an edge of the side surface of the second substrate.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2020-0022753, filed on Feb. 25, 2020, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate generally to a displaydevice and, more specifically, to a method for manufacturing a displaydevice.

Discussion of the Background

Display devices become more and more important as multimedia technologyevolves. Accordingly, a variety of types of display devices such asorganic light-emitting display (OLED) devices and liquid-crystal display(LCD) devices are currently used. Such display devices are used in avariety of applications including mobile electronic devices, e.g.,portable electronic devices such as smart phones, smart watches andtablet PCs.

There is a region where a drive IC or other printed circuits aredisposed on the outer periphery of the glass substrate of the displaydevice. This region may be referred to as a bezel which is a non-displayarea where no image is displayed. For a tiled display apparatus in whicha number of display devices are arranged in a lattice pattern to form alarge screen, the display devices are connected with one another.Therefore, non-display areas are formed where two bezels of adjacentdisplay devices are disposed together.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Applicant realized that the non-display areas where two adjacent bezelsof adjacent display devices in a tiled display meet hinder theexperience of a viewer who sees a disruption in the intended imageviewed across the entire tiled display.

Display devices constructed according to the principles and exemplaryimplementations of the invention significantly reduce the bezel of acurved display device and thereby enhance the viewing experience. Forexample, flexible circuit boards may be attached to the side surface ofthe curved display panel to reduce significantly the bezel area.

Methods of fabricating a curved display device according to theprinciples and exemplary implementations of the invention significantlyreduce the bezel area of a curved display device.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to one aspect of the invention, a display device includes: acurved first substrate; a second substrate opposing the first substrate;a plurality of connection pads disposed on a side surface of the firstsubstrate and a side surface of the second substrate; and at least oneflexible circuit board including a plurality of projections respectivelycoupled to the plurality of connection pads, wherein the plurality ofprojections forms an array of projections along an edge of the sidesurface of the second substrate.

The projections may include bumps extending in different directions.

The angles defined by imaginary lines of adjacent ones of the bumps maybe substantially constant throughout different regions, wherein theimaginary lines may extend in the directions in which the respectivebumps extend.

The at least one flexible circuit board may further include a projectionarea defined as an area from an edge of a projection disposed at an endof the array of projections to an edge of a projection disposed at another end of the array of projections along the array of projections,wherein the projection area may partially overlap the side surface ofthe second substrate, wherein the overlapping area may include a firstarea disposed on one side of an imaginary center line and a second areadisposed on the other side of the imaginary center line, the imaginarycenter line substantially equally dividing the flexible circuit boardand extending in a length direction of the flexible circuit board, andwherein the first area may be substantially equal to the second area.

The first area and second area have shapes that may be substantiallysymmetrical with respect to the imaginary center line.

The projection area may include a bump area and the projections mayinclude bumps disposed substantially symmetrically with respect to theimaginary center line in the array of the bumps.

The spacing between an outer edge of the projection disposed at one endof the array of projections and an outer edge of the projection disposedat the other end of the array of projections may decrease toward acenter of curvature of the second substrate.

The spacing between an outer edge of the projection disposed at one endof the array of projections and an outer edge of the projection disposedat the other end of the array of projections may be substantiallyuniform throughout different regions.

Adhesive films may be disposed between the projections and theconnection pads.

The adhesive films may be disposed to cover the entire connection pads.

The array of projections may have a substantially constant length in athickness of the second substrate.

The spacing between one edge and the other edge of the flexible circuitboard in a direction of the array of projections may be substantiallyuniform throughout different regions.

The spacing between edges of the flexible circuit board in a directionof the array of projections may decrease toward a center of curvature ofthe second substrate in an area where the second substrate overlaps withthe flexible circuit board.

The at least one flexible circuit board may include a plurality offlexible circuit boards, and wherein the plurality of flexible circuitboards may have a curvature substantially equal to a curvature of theedge of the side surface of the second substrate.

The spacing between adjacent ones of the plurality of flexible circuitboards may be substantially uniform.

The plurality of projections may form the array of projections withsubstantially the same curvature.

According to another aspect of the invention, a method of fabricating adisplay device includes the steps of: preparing a curvature jig;preparing a flat panel display panel; curving the flat panel displaypanel using the curvature jig to create a curved display panel; andattaching a flexible circuit board to a side surface of the curveddisplay panel.

The curvature jig may include a first jig having a concave surface and asecond jig having a convex surface.

The step of curving the flat panel display panel may include: placingthe flat panel display panel on the concave surface of the first jig;pressing the flat panel display panel using the convex surface of thesecond jig; and fixing the curved display panel to the curvature jig.

The flexible circuit board may include projections disposed therein,wherein connection pads may be disposed on the side surface of the flatpanel display panel, and wherein the attaching the flexible circuitboard to the side surface of the curved display panel may includecoupling the projections with the connection pads.

The projections may include bumps coupled with the connection pads viaadhesive films.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a front, elevational view illustrating an exemplary embodimentof a tiled display device constructed according to principles of theinvention.

FIG. 2 is a perspective view of an exemplary embodiment of a part of thetiled display device of FIG. 1 .

FIG. 3 is an exploded, perspective view of the part of the displaydevice of FIG. 2 .

FIG. 4 is a cross-sectional view taken along line V-V′ of FIG. 2 .

FIG. 5 is a perspective view of an exemplary embodiment of a data driverconstructed according to principles of the invention.

FIG. 6 is an exploded perspective view illustrating an exemplaryembodiment of coupling of a display panel and a flexible circuit boardaccording to principles of the invention.

FIG. 7 is a perspective view illustrating an exemplary embodiment of anupper bump area constructed according to principles of the invention.

FIG. 8 is an enlarged view illustrating an exemplary embodiment of theside surface of the display panel with the attached connection pad ofthe display device.

FIG. 9 is a plan view showing an exemplary embodiment of an area withattached flexible circuit boards of the display device constructedaccording to principles of the invention.

FIG. 10 is an enlarged view of the area of FIG. 9 with one of theattached flexible circuit boards.

FIG. 11 is a flowchart for illustrating an exemplary embodiment of amethod for fabricating the display device according to principles of theinvention.

FIGS. 12 to 14 are cross-sectional views for illustrating the method offabricating the display device according to the flowchart of FIG. 11 .

FIG. 15 is an enlarged view of another exemplary embodiment of the areaof a display panel with an attached flexible circuit board constructedaccording to principles of the invention.

FIG. 16 is an enlarged view of a further exemplary embodiment of thearea of a display panel with an attached flexible circuit boardconstructed according to principles of the invention constructedaccording to principles of the invention.

FIG. 17 is an enlarged view of yet another exemplary embodiment of thearea of a display panel with an attached flexible circuit boardconstructed according to principles of the invention.

FIG. 18 is a plan view illustrating an exemplary embodiment of the upperbump area of the flexible circuit board of FIG. 17 .

FIG. 19 is an enlarged view of still another exemplary embodiment thearea of a display panel with an attached flexible circuit boardconstructed according to principles of the invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a front, elevational view illustrating an exemplary embodimentof a tiled display device constructed according to principles of theinvention.

As used herein, “above” and “top surface” in the thickness direction mayrefer to the side of the display device 1 on which images are displayedor the side indicated by the arrow of in the third direction DR3,whereas “below” and “bottom surface” may refer to the opposite side ofthe display device 1 or the opposite side in the third direction DR3,unless stated otherwise. In addition, “upper side,” “lower side,” “leftside,” and “right side” in the plane may be defined when the displaysurface is viewed from the top. For example, the “left side” may referto the opposite side to the side indicated by the arrow of the firstdirection DR1, the “right side” may refer to the side indicated by thearrow of the first direction DR1, the “upper side” may refer to the sideindicated by the arrow of the second direction DR2, and the “lower side”may refer to the opposite side to the side indicated by the arrow of thesecond direction DR2.

The display device 1 may be a self-luminous display device such as anorganic light-emitting display device, a quantum-dot light-emittingdisplay device, a micro LED display device and a nano LED displaydevice. Alternatively, the display device 1 may be a non-self-luminousdisplay device such as an electrophoretic display device and anelectrowetting display device. In the following description, aliquid-crystal display device including a liquid-crystal layer isemployed as the display device, but the exemplary embodiments are notlimited thereto. For example, the display device other than aliquid-crystal display device (for example, an organic light-emittingdisplay device) may be employed, in which case some elements describedbelow may be eliminated, or other elements may be added.

A display device 1 according to some exemplary embodiments may be usedin a large electronic device such as a television and an electric board,as well as in a small and medium electronic device such as a personalcomputer, a laptop computer, a vehicle navigation device and a camera,etc. In addition, the display device may be used in a tablet PC, a smartphone, a personal digital assistant (PDA), a portable multimedia player(PMP), a game device, a wristwatch type electronic device, etc. Theabove-listed electronic devices are merely illustrative and the displaydevice may be employed in other display devices such as tiled displayapparatus.

Referring to FIG. 1 , a tiled display apparatus TDD may include aplurality of display devices 1. In the exemplary embodiments, theplurality of display devices 1 may be arranged in a lattice pattern, butthe exemplary embodiments are not limited thereto. The display devices 1may be connected in the first direction DR1 or the second direction DR2or may be connected in a particular pattern. The display devices mayhave the same size, but the exemplary embodiments are not limitedthereto. The display devices may have different sizes.

The plurality of display devices 1 included in the tiled displayapparatus TD may have a generally rectangular shape including longersides and shorter sides. The longer sides or the shorter sides of eachof the plurality of display devices 1 may be connected to the longersides or the shorter sides of adjacent ones of the display devices. Someof the display devices 1 may form the respective sides of the tileddisplay apparatus TDD, some others of the display devices 1 may belocated at the respective corners of the tiled display apparatus TDD toform two adjacent sides, and the rest of the display devices 1 may belocated on the inner side of the tiled display apparatus TDD andsurrounded by the others of the display devices 1.

Each of the display devices 1 may include a display area DA and anon-display area NDA. The display area DA is where images are displayed.The non-display area NDA is where no image is displayed, i.e., the bezelof the display device 1 and may be disposed around the display area NDA.The non-display area NDA may surround the display area DA, but theexemplary embodiments are not limited thereto. The display devices 1 mayhave different bezel shapes depending on the locations, or may have thesame bezel shape.

The tiled display apparatus TDD may have a generally planar shape, butthe exemplary embodiments are not limited thereto. The tiled displayapparatus TD may have a three-dimensional shape to give athree-dimensional effect. When the tiled display apparatus TDD has athree-dimensional shape, each of the display devices 1 included in thetiled display apparatus TDD may have a generally curved shape, and maybe connected to one another in a generally planar shape or at apredetermined angle, such that the tiled display apparatus TDD may beformed in three-dimensional shape. It is, however, to be understood thatthe exemplary embodiments are not limited thereto. The tiled distanceapparatus TDD may be a generally flat display apparatus.

The bezels of the plurality of display devices 1, which are defined asthe non-display areas NDA, may be connected with one another directly.Alternatively, they may be connected with one another by a connectingmember. As such, since the display devices 1 are connected with oneanother in the tiled display apparatus TDD, two bezels of the adjacentdisplay devices 1 are disposed together at the connection portions.Therefore, each of the display devices 1 is required to have a thinbezel. To this end, it is contemplated that a connection pad of aflexible circuit board is connected to the side surface of each of thedisplay devices 1, as described in more detail below. Hereinafter,exemplary embodiments of the display device 1 are described in detail,and may be employed as one of the display devices 1 of the tiled displayapparatus TDD or may be used alone.

FIG. 2 is a perspective view of an exemplary embodiment of a part of thetiled display device of FIG. 1 . FIG. 3 is an exploded, perspective viewof the part of the display device of FIG. 2 . FIG. 4 is across-sectional view taken along line V-V of FIG. 2 .

Referring to FIGS. 2 to 4 , the display device 1 according to someexemplary embodiments may be a curved display device 1. The curveddisplay device 1 may include a curved display panel DP. According to anexemplary embodiment, the curved display device 1 may be aliquid-crystal display device. In such case, the display panel DP mayinclude a curved first substrate 100, a curved second substrate 200disposed on the first substrate 100, and a liquid-crystal layerinterposed between the first substrate 100 and the second substrate 200.According to another exemplary embodiment, the curved display device 1may be an organic light-emitting display device. In such case, thedisplay panel DP may include a curved first substrate 100, a curvedsecond substrate 200 disposed on the first substrate 100, and an organicemission layer interposed between the first substrate 100 and the secondsubstrate 200. The second substrate 200 may be an encapsulationsubstrate or a panel protection member. In the following description, aliquid-crystal display device is employed as the curved display device 11, but the exemplary embodiments are not limited thereto.

The shape of the display panel DP may be generally rectangular havinglonger sides in the first direction DR1 and shorter sides in the seconddirection DR2 when viewed from the top. However, the shape of thedisplay panel DP is not limited thereto, and may have a curved portionin some regions when viewed from the top.

The display panel DP may have a shape having curved longer sides orcurved shorter sides, but the exemplary embodiments are not limitedthereto. Both the longer sides and the shorter sides may have a curvedshape. Although the display panel DP may have a substantially constantradius of curvature throughout the entire region, the exemplaryembodiments are not limited thereto. It may have different radii ofcurvature for different regions. In the following description, thedisplay panel DP having the curved longer sides will be described as anexample.

The first substrate 100 may include a plurality of pixels PX. Theplurality of pixels PX may be arranged in a matrix. It is, however, tobe understood that the exemplary embodiments are not limited thereto. Aplurality of scan lines SL1 to SLn and a plurality of data lines DL1 toDLm may be disposed along the boundaries of the pixels PX, where n and mare natural numbers.

The scan lines SL1 to SLn and the data lines DL1 to DLm may be arrangedto intersect each other. The scan lines SL1 to SLn and the data linesDL1 to DLm may be insulated from one another. The scan lines SL1 to SLnmay extend in the first direction DR1 to be electrically connected to agate driver SGD. The data lines DL1 to DLm may extend in the seconddirection DR2 and may be connected to data drivers SDD.

The pixels PX may be disposed at the respective intersections betweenthe scan lines SL1 to SLn and the data lines DL1 to DLm. Each of thepixels PX may be electrically connected to the scan lines SL1 to SLn andthe data lines DL1 to DLm. The plurality of scan lines SL1 to SLn mayserve as selection lines for selecting from among the plurality ofpixels PXm, where n is a natural number.

Although only one representative pixel PX is depicted in FIG. 3 forconvenience of illustration, it is to be understood that a plurality ofpixels PX may be disposed in practice. The plurality of pixels PX may bearranged in a matrix. It is, however, to be understood that theexemplary embodiments are not limited thereto. In each of the pixels PX,a representative pixel electrode defining the pixel may be disposed.

A timing controller may receive an image signal and a control signalfrom an external device. The timing controller may process the imagesignal and the control signal appropriately for the operating conditionsof the display panel DP, thereby generating image data, a first controlsignal, and a second control signal. The image signal may include aplurality of grayscale data to be transferred to the display panel DP.In addition, the control signal may include a horizontal synchronizationsignal, a vertical synchronization signal, and a main clock signal. Themain clock signal may be used as a reference signal when the timingcontroller is in synchronization with each of the gate driver SGD andthe data drivers SDD for generating various signals.

The gate driver SGD may receive the first control signal from the timingcontroller. The gate driver SGD may generate a scan signal in responseto the first control signal and may output the generated scan signalssequentially. The scan signal may be provided to the pixels PXrow-by-row through the scan lines SL1 to SLn. As a result, the pixels PXcan be driven row-by-row.

The gate driver SGD may be disposed at a location adjacent to at leastone of the shorter sides of the first substrate 100. It is, however, tobe understood that the exemplary embodiments are not limited thereto.For example, the gate driver SGD may be formed during a process offabricating transistors for driving the pixels PX and may be mounted onthe first substrate 100 in the form of an amorphous silicon TFT gatedriver circuit (ASG) or an oxide silicon TFT gate driver circuit (OSG).It is, however, to be understood that the exemplary embodiments are notlimited thereto. The gate driver SGD may be formed of a plurality ofdriving chips, may be mounted on a flexible driving circuit board, andmay be mounted on the first substrate 100 by using tape carrier package(TCP) technique. The gate driver SGD may be formed of a plurality ofdriving chips and may be mounted on the first substrate 100 by usingchip-on-glass (COG) technique.

The data drivers SDD may receive a second control signal and image datafrom the timing controller. The data drivers SDD may generate a datasignal based on the second control signal and image data. The datadrivers SDD may provide the generated data signals to the pixels PXthrough the data lines DL1 to DLm.

The data signals may be provided to the pixels PX through the data linesDL1 to DLm. The pixels PX may receive the data signals D1 to Dm throughthe data lines DL1 to DLm in response to scan signals provided throughthe scan lines SL1 to SLn. The pixels PX may represent grayscale levelscorresponding to the data signals D1 to Dm, so that the transmittance ofthe area in which each of the pixels PX is disposed can be controlled.

Each of the data drivers SDD may include a flexible circuit board 400and a source driving chip IC disposed on the flexible circuit board 400.The flexible circuit board 400 may be disposed adjacent to the sidesurface of the longer side of the display panel DP to be connected tothe display panel DP. It is, however, to be understood that theexemplary embodiments are not limited thereto. The location of thedisplay panel DP where the flexible circuit board 400 is connected maybe altered as desired. For example, the flexible circuit board 400 maybe disposed adjacent to one of the shorter sides of the display panel DPto be connected to the display panel DP. Alternatively, the flexiblecircuit board 400 may be disposed on each of the longer sides of thedisplay panel DP. Alternatively, the flexible circuit board 400 may bedisposed on each of the shorter sides of the display panel DP.Alternatively, the flexible circuit board 400 may be disposed on each ofthe longer sides and each of the shorter sides of the display panel DP.

The flexible circuit board 400 may be attached to a connection pad 500of the display panel DP through an adhesive film 600. For example, anupper bump BPU of the flexible circuit board 400 and the display panelDP may be electrically connected by an outer lead bonding (OLB) usingthe adhesive film 600. The adhesive film 600 may be disposed to coverthe entire connection pad 500 of the display panel DP, but the exemplaryembodiments are not limited thereto. A part of the connection pad 500 ofthe display panel DP may be exposed.

The first substrate 100 may include a first base substrate 110, aconnection line 120, and an insulating layer 130. The connection line120 may be disposed on the first base substrate 110. The connection line120 may be electrically connected to the scan lines SL1 to SLn and thedata lines DL1 to DLm.

The insulating layer 130 may be disposed on the connection line 120. Theinsulating layer 130 may include a contact hole exposing the connectionline 120 near one side of the first substrate 100. The insulating layer130 may be made of a material including an insulating material. In someexemplary embodiments, the insulating material may be an inorganicinsulating material or an organic insulating material. The inorganicinsulating material may include at least one of an aluminum oxide, atitanium oxide, a silicon oxide, a silicon oxynitride, a zirconiumoxide, and a hafnium oxide. The organic insulating material may includeat least one selected from the group consisting of: an acrylic resin, amethacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, aurethane resin, a cellulose resin, a siloxane resin, a polyimide resin,a polyamide resin, and a perylene resin.

A connection pad 510 may be disposed on the contact hole of theinsulating layer 130 and the insulating layer 130 around the contacthole. The connection pad 510 may be in contact with the connection line120 through the contact hole of the insulating layer 130. Accordingly,the connection pad 510 may be electrically connected to the connectionline 120. It is, however, to be noted that the configuration of theconnection pad 510 is not limited thereto. For example, the connectionpad 510 may be disposed only in the contact hole of the insulating layer130. In addition, the connection pad 510 may be formed integrally withthe connection line 120.

The connection line 120 may extend from the side surface of the firstsubstrate 100 toward the inside (e.g., extending in the second directionDR2) and may be electrically connected to the plurality of pixels PX.The connection pad 500 may be made of, but is not limited to, aluminum(Al), silver (Ag) or the like.

The source driving chip IC mounted on the flexible circuit board 400 maygenerate data voltages for driving the pixels PX electrically connectedthrough the connection pad 500. The data voltages thus generated may betransmitted to the data lines DL1 to DLm through the connection pad 500and the connection pad 510.

The flexible circuit board 400 may include the upper bump BPU. Thesource driving chip IC may be electrically connected to the upper bumpBPU of the flexible circuit board 400. The upper bump BPU of theflexible circuit board 400 may be electrically connected to theconnection pad 500 disposed on the side surfaces of the first and secondsubstrates 100 and 200 through the adhesive film 600.

FIG. 5 is a perspective view of an exemplary embodiment of a data driverconstructed according to principles of the invention. FIG. 6 is anexploded perspective view illustrating an exemplary embodiment ofcoupling of a display panel and a flexible circuit board according toprinciples of the invention. FIG. 7 is a perspective view illustratingan exemplary embodiment of an upper bump area constructed according toprinciples of the invention. FIG. 8 is an enlarged view illustrating anexemplary embodiment of the side surface of the display panel with theattached connection pad of the display device.

The adhesive film 600 may be disposed between the connection pad 500 andthe flexible circuit board 400. The adhesive film 600 may electricallyconnect the connection pad 500 with the upper bump BPU of the flexiblecircuit board 400. The adhesive film 600 may be disposed to cover theconnection pad 500 and an upper bump area BPAU entirely. The adhesivefilm 600 may have an area substantially equal to or larger than the areaof the upper bump area BPAU and the connection pad 500. The shape of theadhesive film 600 may conform to the shape of the upper bump area BPAUand the connection pad 500 when viewed from the top.

The adhesive film 600 may include an anisotropic conductive film (ACF).When the adhesive film 600 is an anisotropic conductive film, it mayhave conductivity only in a region where the connection pad 500 of thedisplay panel DP is in contact with and the upper bump BPU of theflexible circuit board 400 to thereby electrically connect them.According to another exemplary embodiment, the connection pad 500 of thedisplay panel DP may be in contact with the upper bump BPU andelectrically connected with each other, without the adhesive film 600.For example, the connection pad 500 of the display panel DP may beconnected directly to the upper bump BPU of the flexible circuit board400 by a method such as ultrasonic bonding, welding or laser bonding.

A color filter and a sealant SL may be disposed between the firstsubstrate 100 and the second substrate 200. The color filter may serveto improve the quality of the image output from the display device 1,and the sealant SL may be disposed along the edges of the first andsecond substrates 100 and 200 on the outer side of the color filter inorder to prevent leakage of the liquid-crystal layer 300 disposedbetween the first and second substrates 100 and 200.

A dummy pattern DMP may be disposed adjacent to the connection pad 500between the first substrate 100 and the second substrate 200. The dummypattern DMP may be fixed to the second substrate 200 and may have an endfacing the first substrate 100. In addition, the end of the dummypattern DMP may be in contact with the features on the first substrate100. For example, the end of the dummy pattern DMP may be in contactwith the connection pad 510 and the insulating layer 130. The dummypattern DMP may extend linearly between one side surface of the firstsubstrate 100 and one side surface of the second substrate 200 whenviewed from the top. It is, however, to be understood that the exemplaryembodiments are not limited thereto. The dummy pattern DMP may bedisposed in the form of an island aligned with the connection pad 500.In addition, the dummy pattern DMP may be disposed on the sides suchthat it surrounds the edges of the first substrate 100 and the secondsubstrate 200.

The space between the first substrate 100 and the second substrate 200and the space between the sealant SL and the connection pad 500 may befilled with the dummy pattern DMP. The dummy pattern DMP may be made of,but is not limited to, an insulating material such as an organicinsulating material, an inorganic insulating material, and a resin.

The second substrate 200 may be disposed on the first substrate 100.Specifically, the second substrate 200 may be spaced apart from thefirst substrate 100 in the third direction DR3. The liquid-crystal layer300 may be disposed between the second substrate 200 and the firstsubstrate 100.

A common electrode for applying an electric field to the liquid-crystallayer 200 together with the pixel electrode of the first substrate 100may be disposed on the second substrate 300, but the exemplaryembodiments are not limited thereto. Both the pixel electrode PE and thecommon electrode may be disposed on the first substrate 100.

The second substrate 200 may include a second base substrate 220, ablack matrix BM, and an overcoat layer OC. The black matrix BM and theovercoat layer OC covering the black matrix BM may be disposed on thesecond base substrate 220. The black matrix BM may be disposed in agenerally lattice pattern when viewed from the top, and can preventlight mixing between adjacent pixels PX and light leakage through a sideof the display device 1. The black matrix BM may be made of, but is notlimited to, an organic material or a metal material including chromium.A color filter pattern may be further disposed on the second basesubstrate 220. The color filter pattern may serve to improve the qualityof images output from the display device 1. The overcoat layer OC mayinclude an insulating material, and may provide a generally flat surfaceover the level differences created by the black matrix BM and the colorfilter pattern. It is, however, to be understood that the exemplaryembodiments are not limited thereto. The black matrix BM and the colorfilter pattern may be disposed on the first substrate 100.

The display device 1 according to some exemplary embodiments may furtherinclude a backlight unit BLU. The backlight unit BLU may generate lightand may provide the generated light to the display panel DP includingthe first substrate 100, the second substrate 200 and the liquid-crystallayer 300. The display panel DP may generate an image using lightreceived from the backlight unit BLU and provide it to the outside. Thebacklight unit BLU may be, for example, an edge-lit backlight unit or adirect-lit backlight unit, but the exemplary embodiments are not limitedthereto.

The display device 1 may further include an optical sheet including apolarizing sheet disposed between the backlight unit BLU and the firstsubstrate 100. Such an optical sheet may control the characteristics oflight provided from the backlight unit BLU so that the transmittance oflight passing through the display panel DP is effectively controlled. Inaddition, the display device 1 may further include a housing member foraccommodating the display panel DP.

The display panel DP according to some exemplary embodiments may be acurved display panel DP having a predetermined curvature. The radius ofcurvature of the display panel DP may be uniform generally, but theexemplary embodiments are not limited thereto. The display panel DP mayhave different radii of curvature for different regions. In the displaypanel DP, one side surface in the third direction DR3 may be generallyconcave, and the other side surface in the third direction DR3 may begenerally convex. A center of curvature COC of the display panel DP maybe located at a point spaced apart from the concave surface of thedisplay panel DP in the third direction DR3. For example, for thedisplay panel DP having a generally uniform radius of curvature, thecenter of curvature COC may be a single point. However, for the displaypanel DP having different radii of curvature for different regions,there may be different centers of curvature COC for different regionsdepending on the radii of curvature. Although FIG. 8 shows the displaypanel DP having a generally uniform radius of curvature and thus havingthe center of curvature COC of a single point as an example, theexemplary embodiments are not limited thereto.

As depicted in FIGS. 2, 5 , the data drivers SDD may include theflexible circuit board 400 and the source driving chip IC disposed onthe flexible circuit board 400. The flexible circuit board 400 mayinclude the upper bump area BPAU and the lower bump area BPAB disposedon a surface thereof and at least one area BPAU and BPAB hasprojections, which may be in the form of bumps, as described below. Aplurality of upper bumps BPU may be disposed in the upper bump area BPAUof the flexible circuit board 400. At least one lower bump may bedisposed in the lower bump area BPAB of the flexible circuit board 400.

The upper bumps BPU may be the parts of the flexible circuit board 400that are connected to the display panel DP. Specifically, the upperbumps BPU of the flexible circuit board 400 may be attached to theconnection pad 500 disposed on the side surface of the display panel DPthrough the adhesive film 600 and electrically connected. The sourcedriving chip IC may be electrically connected to the upper bump BPU ofthe flexible circuit board 400. Therefore, the source driving chip ICmay be electrically connected to the display panel DP.

Referring to FIG. 7 , the plurality of upper bumps BPU disposed on theflexible circuit board 400 may be arranged with the same curvature asthe curvature of the edge 230 of the side surface of the secondsubstrate 200. The length of an array ARR of the upper bumps BPU in thethickness direction of the second substrate 200 may be substantiallyconstant. The upper bump area BPAU may be defined as the area from oneedge of the upper bump BPU disposed at one end of the array ARR of theupper bumps BPU to the opposite edge of the upper bump BPU disposed atthe opposite end thereof along the array ARR of the upper bumps BPU.

The upper bump area BPAU may be surrounded by first to fourth sidesBPAS1 to BPAS4. The first side BPAS1 may be a line connecting the edgesof the upper bumps BPU on the upper side in the third direction DR3. Thesecond side BPAS2 may be a line connecting the edges of the upper bumpsBPU on the lower side in the third direction DR3. The third side BPAS3may be the edge of the outermost upper bump BPU disposed on the otherside in the first direction DR1. The fourth side BPAS4 may be the edgeof the outermost upper bump BPU disposed on the one side in the firstdirection DR1. Although the first to fourth sides BPAS1 to BPAS4 arespaced apart from the sides of the upper bumps BPU in the example shownin FIG. 7 , this is merely illustrative.

The first side BPAS1 may be substantially equally spaced apart from thesecond side BPAS2 across different regions. It is, however, to beunderstood that the exemplary embodiments are not limited thereto.

The upper bump area BPAU may have a curved shape such that the sideBPAS1 (or the first side) is concave toward the lower side in the thirddirection DR3 and the opposite side (or the second side) is convextoward the lower side in the third direction DR3. The curvature of thefirst side BPAS1 and the second side BPAS2 of the upper bump area BPAUmay be substantially equal to the curvature of the edge 230 of the sidesurface of the display panel DP to which the flexible circuit board 400is attached. For example, the curvature of the first side BPAS1 and thesecond side BPAS2 of the upper bump area BPAU may be substantially equalto the curvature of the edge 230 of the side surface of the firstsubstrate 100. In addition, the curvature of the first side BPAS1 andthe second side BPAS2 of the upper bump area BPAU may be substantiallyequal to the curvature of the edge 230 of the side surface of the secondsubstrate 200. That is to say, the upper bump area BPAU in which theupper bumps BPAU of the flexible circuit board 400 are disposed may bedesigned in a variety of ways depending on the curvature of the displaypanel DP to which the flexible circuit board 400 is attached.

The upper bumps BPU each may have a generally rectangular shape and mayextend in different directions. The direction in which the upper bumpsBPU extend may be generally inward toward the center of curvature COC ofthe display panel DP. For example, one edge and the other edge of one ofthe upper bumps BPU in the first direction DR1 may face the center ofcurvature COC of the display panel DP.

The shortest distance from one edge of each of the upper bumps BPU onthe upper side in the third direction DR3 to the edge of the secondsubstrate 200 on the upper side in the third direction DR3 may havesubstantially the same value. For example, among the upper bumps BPUdisposed in one upper bump area BPAU, the shortest distance dc from theedge of the upper bump BPU disposed at the center to the edge of thesecond substrate 200 may be substantially equal to the shortest distancedo from the edge of the leftmost upper bump BPU to the edge of thesecond substrate 200.

An imaginary line passing through each of the upper bumps BPU disposedin a upper bump area BPAU and extend generally parallel to the directionin which each of the upper bumps BPU extend may intersect at the centerof curvature COC of the display panel DP to which each of the upperbumps BPU is connected. For example, among a plurality of upper bumpsBPU disposed in an upper bump area BPAU, an imaginary line ILc passingthrough the upper bump BPU disposed at the center and extend generallyparallel to the direction in which the upper bump BPU extends and animaginary line ILo passing through the leftmost upper bump BPU andextending in the length direction of the upper bump BPU may intersect atthe center of curvature COC of the display panel DP to which the upperbump BPU is attached.

The lower bump area BPAB may have, but is not limited to, a generallyrectangular shape. The lower bump area BPAB may be the part of theflexible circuit board 400 that is connected to the driving circuitboard SPCB, as depicted in FIG. 2 . The flexible circuit board 400 maybe implemented in the form of a flexible printed circuit board.Specifically, the flexible circuit board 400 may be implemented as achip-on film (COF). Accordingly, the data drivers SDD may be connectedto the first and second substrates 100 and 200 and the driving circuitboard SPCB by a tape carrier package (TCP) technique, and as shown inFIG. 2 , the flexible circuit boards 400 may be bent under the rearsurface of the second substrate 200 such that the driving circuit boardSPCB may be located on the rear surface of the second substrate 300. Insuch case, the source driving chip IC may be disposed between the secondsubstrate 200 and the flexible circuit board 400, but the exemplaryembodiments are not limited thereto. The source driving chip IC may bedisposed on the opposite surface of the flexible circuit board 400.

The source driving chip IC may be disposed substantially at the centerof the flexible circuit board 400. The source driving chip IC may bedisposed between the upper bump area BPAU and the lower bump area BPAB.The source driving chip IC may include a shift register, a latch, adigital-to-analog converter, etc. One data driver SDD may include asingle source driving chip IC or a plurality of source driving chips IC.Although one source driving chip IC is disposed on the flexible circuitboard 400 of the data driver SDD in the exemplary embodiment shown inthe drawing, the exemplary embodiments are not limited thereto. Inaddition, although the display device 1 according to some exemplaryembodiments includes five data drivers SDD, it will be understood thatthe number is not limited to five.

As described above, the connection pads 500 may be disposed on the sidesurface of the display panel DP. The plurality of connection pads 500 ofthe display panel DP may be arranged in a row along the side surface ofthe display panel DP to form a curve, but the exemplary embodiments arenot limited thereto. They may be arranged in a matrix. The arrangementof the connection pads 500 arranged in a row may be curved withsubstantially the same curvature as the edge of the side surface of thedisplay panel DP. For example, the array ARR of the connection pads 500may have substantially the same curvature as the edge of the sidesurface of the first substrate 100. In addition, the array ARR of theconnection pads 500 may have substantially the same curvature as theedge of the side surface of the second substrate 200. It is, however, tobe understood that the exemplary embodiments are not limited thereto.

As shown in FIG. 8 , a connection pad area 500A may be defined by animaginary line surrounding the array ARR of the connection pads 500arranged in a row. Alternatively, the connection pad area 500A may bedefined by an imaginary line surrounding and spaced apart from the arrayARR of the connection pads 500 by a predetermined spacing distance.

The connection pads 500 may have substantially the same shape as theshape of the upper bumps BPU connected thereto. For example, theconnection pads 500 each may have a generally rectangular shape and mayextend in different directions. The direction in which the connectionpads 500 extend may be generally toward the center of curvature COC ofthe display panel DP. For example, one edge and the other edge of one ofthe connection pads 500 in the first direction DR1 may face the centerof curvature COC of the display panel DP.

FIG. 9 is a plan view showing an exemplary embodiment of an area withattached flexible circuit boards of the display device constructedaccording to principles of the invention. FIG. 10 is an enlarged view ofthe area of FIG. 9 with one of the attached flexible circuit boards.

For convenience of illustration, although FIGS. 9 and 10 show theflexible circuit boards 400 in which the upper bump areas BPAU aredisposed, the upper bumps BPU may be disposed in each of the upper bumpareas BPAU as described above with reference to FIG. 7 .

Referring to FIGS. 9 and 10 , first to fifth flexible circuit boards4001 to 4005 may be arranged sequentially on the side surface of thedisplay panel DP and spaced apart from one another from one side to theother side in the first direction DR1. Conforming to the curved displaypanel DP, the first to fifth flexible circuit boards 4001 to 4005 may bedisposed such that they may extend generally toward the center ofcurvature COC of the display panel DP.

The flexible circuit boards 4001 to 4005 on the side surface of thedisplay panel DP may not protrude above the upper side of the displaypanel in the third direction DR3. Specifically, when viewed from thetop, the edge of each of the flexible circuit boards 4001 to 4005 on theupper side in the third direction DR3 may be aligned with the edge ofthe display panel DP on the upper side in the third direction DR3 or maybe disposed on the inner side of the display panel DP. In the followingdescription, the display panel DP having five flexible circuit boards4001 to 4005 attached to the side surface will be described as anexample. It is, however, to be understood that the number of flexiblecircuit boards 4001 to 4005 attached to the side surface of the displaypanel DP is not limited to five.

First to fifth center lines IL1 to IL5 may be defined in the flexiblecircuit boards 4001 to 4005, respectively, which are imaginary linesthat substantially equally divide the respective flexible circuit boards4001 to 4005 and penetrate the display panel DP in the thicknessdirection in the side view. The first to fifth center lines IL1 to IL5may pass through the same center of curvature COC. However, when thedisplay panel DP has different radii of curvature for different regionsin which the first to fifth flexible circuit boards 4001 to 4005 aredisposed, the first to fifth center lines IL1 to IL5 may pass throughdifferent centers of curvature COC.

The adjacent angles α12 to α45 defined as the angles between adjacentones of the center lines IL1 to IL5 may be substantially equal to oneanother. For example, the adjacent angle α12 formed as the first andsecond center lines IL1 and IL2 intersect, the adjacent angles α23formed as the second and third center lines IL2 and IL3 intersect, theadjacent angle α34 formed as the third and fourth center lines IL3 andIL4 intersect, and the adjacent angle α45 formed as the fourth and fifthcenter lines IL4 and IL5 intersect may have the same value. It is,however, to be understood that the exemplary embodiments are not limitedthereto. The adjacent angles α12 to α45 may have different values.

The spacing distance between the adjacent ones of the first to fifthflexible circuit boards 4001 to 4005 may be defined as the distancebetween points at which the first to fifth center lines IL1 to IL5overlap the edges of the flexible circuit boards 4001 to 4005 in thethird direction DR3 in the side view of FIG. 8 . The spacing distancesbetween the adjacent ones of the first to fifth flexible circuit boards4001 to 4005 may be substantially constant. It is, however, to beunderstood that the exemplary embodiments are not limited thereto. Thedistances may be different from one another.

As described above, the flexible circuit boards 4001 to 4005 may includethe first to fifth upper bump areas BPAU1 to BPAU5, respectively. Theupper bump areas BPAU1 to BPAU5 may be disposed on the side surfaces ofthe flexible circuit boards 4001 to 4005 that face the display panel DP,respectively. That is to say, the upper bump areas BPAU1 to BPAU5 may bedisposed on the side surfaces of the flexible circuit boards 4001 to4005 in the second direction DR2, respectively. In addition, in the sideview of FIG. 10 , the upper bump areas BPAU1 to BPAU5 may overlap theside surface of the display panel DP in the second direction DR2.Specifically, the upper bump areas BPAU1 to BPAU5 partially overlapswith the side surface of the second substrate 200 in the seconddirection DR2, and partially overlaps with the side surface of the firstsubstrate 100 in the second direction DR2.

Referring to FIGS. 7 and 10 , the upper bump area BPAU may be surroundedby a first side BPAS1 disposed on the upper side in the third directionDR3, a second side BPAS2 disposed on the lower side in the third sideDR3 from the first side BPAS1, a third side BPAS3 connecting the firstside BPAS1 with the second side BPAS2 on the other side in the firstdirection DR1, and a fourth side BPAS4 connecting the first side BPAS1with the second side BPAS2 on one side in the first direction DR1. Thefirst and second sides BPAS1 and BPAS2 may be spaced apart from theedges of the side surface of the first and second substrates 100 and 200across different regions. It is, however, to be understood that theexemplary embodiments are not limited thereto.

The shape of the upper bump area BPAU may conform to the shape of theconnection pad area 500A disposed on the side surface of the curveddisplay panel DP. The connection pad area 500A may have a curved shapeaccording to the curvature of the area of the display panel DP where theconnection pads 500 are attached. In order to make sure that the upperbumps BPU overlap with the connection pads 500, the shape of the upperbump area BPAU may conform to the shape of the connection pad area 500Aattached thereto. As the upper bump area BPAU and the connection pads500 overlap each other reliably, the adhesion between the flexiblecircuit boards 400 and the display panel DP can be increased, therebyreducing the stress between them. Therefore, the flexible circuit boards400 can be effectively attached on the side surface of the display panelDP.

The tangent line of the first side BPAS1 at the point at which the firstside BPAS1 intersects the center line IL may be generally perpendicularto the center line IL. Likewise, the tangent line of the second sideBPAS2 at the point at which the second side BPAS2 intersects the centerline IL may be generally perpendicular to the center line IL. It is,however, to be understood that the exemplary embodiments are not limitedthereto.

The imaginary line extending along the third side BPAS3 and theimaginary line extending along the fourth side BPAS4 may extend towardthe center of curvature COC of the display panel DP. The imaginary lineextending along the third side BPAS3 and the imaginary line extendingalong the fourth side BPAS4 may pass through the center of curvature COCof the display panel DP. The imaginary line extending along the thirdside BPAS3 and the imaginary line extending along the fourth side BPAS4may intersect at the center of curvature COC to form a center angle β.The imaginary line IL may substantially equally divide the central angleβ.

The tangent line of the second side BPAS2 at the point at which thesecond side BPAS2 intersects the third side BPAS3 may be generallyperpendicular to the third side BPAS3. Likewise, the tangent line of thesecond side BPAS2 at the point at which the second side BPAS2 intersectsthe fourth side BPAS4 may be generally perpendicular to the fourth sideBPAS4. It is, however, to be understood that the exemplary embodimentsare not limited thereto.

The upper side 410 (or the side in the third direction DR3) of theflexible circuit board 400 may be substantially equally divided by thecenter line IL and may include first and second upper sides 411 and 412.The left side 420 of the flexible circuit board 400 (or the edge on theother side in the first direction DR1) may be bent and extended towardthe lower side in the third direction DR3 from the end of the upper side410 (or the edge on the upper side in the third direction DR3) of theflexible circuit board 400 on the other side in the first direction DR1.The right side 430 of the flexible circuit board 400 (or the edge on theone side in the first direction DR1) may be bent and extended toward thelower side in the third direction DR3 from the end of the upper side 410(or the edge on the upper side in the third direction DR3) of theflexible circuit board 400 on the one side in the first direction DR1.The left side 420 (or the edge on the other side in the first directionDR1) of the flexible circuit board 400 may be generally parallel to theright side 430 (or the edge on the one side in the first direction DR1)of the flexible circuit board 400. Accordingly, the spacing distancebetween the left side 420 (or the edge on the other side in the firstdirection DR1) of the flexible circuit board 400 the right side 430 (orthe edge on the one side in the first direction DR1) of the flexiblecircuit board 400 may be substantially uniform throughout differentregions.

In the side view of FIG. 10 , the part of the upper side 210 of thesecond substrate 300 (or the edge on the upper side in the thirddirection DR3 between the point at which the image line extending alongthe left side 420 (or the edge on the other side in the first directionDR1) of the flexible circuit board 400 intersects and the point at whichthe image line extending along the right side 430 (or the edge on theside in the first direction DR1) of the flexible circuit board 400intersects is substantially equally divided into first and second parts211 and 212 by the center line IL.

In the side view, a first area S1 may be defined by the imaginary lineextending along the left side 420 of the flexible circuit board 400 (orthe edge on the other side in the first direction DR1), the upper side410 of the flexible circuit board 400 (or the edge on the upper side inthe third direction DR3), the center line, and the upper side 210 of thesecond substrate 200 (or the edge on the upper side in the thirddirection DR3). In addition, a second area S2 may be defined by theimaginary line extending along the right side 430 of the flexiblecircuit board 400 (or the edge on the side in the first direction DR1),the upper side 410 of the flexible circuit board 400 (or the edge on theupper side in the third direction DR3), the center line, and the upperside 210 of the second substrate 200 (or the edge on the upper side inthe third direction DR3).

In addition, in the side view, some regions of the side surface of thesecond substrate 200 that is disposed the imaginary line extending alongthe left side 420 of the flexible circuit board 400 and the imaginaryline extending along the right side 430 may include an overlappingportion overlapping with the flexible circuit board in the seconddirection DR2 and non-overlapping portions S1 and S2. Thenon-overlapping portions S1 and S2 may include a first area S1 disposedon the other side in the first direction DR1 with respect to the centerline IL and a second region S2 disposed on the one side.

In the side view, the first region S1 may not overlap with the flexiblecircuit board 400 in the second direction DR2 on the side surface of thedisplay panel DP disposed between the imaginary line extending along theleft side 420 of the flexible circuit board 400 (or the edge on theother side in the first direction DR1) and the center line IL. In theside view, the second region S2 may not overlap with the flexiblecircuit board 400 in the second direction DR2 on the side surface of thedisplay panel DP disposed between the imaginary line extending along theright side 420 of the flexible circuit board 400 (or the edge on the oneside in the first direction DR1) and the center line IL.

The first region S1 and the second region S2 may be in contact with eachother. The first region S1 may be disposed on the other side of thesecond region S2 in the first direction DR1, and the second region S2may be disposed on one side of the first region S1 in the firstdirection DR1. For example, one side of the first region S1 in the firstdirection DR1 may form the other side of the second region S2 in thefirst direction DR1, and the other side of the second region S2 in thefirst direction DR1 may form one side of the first area S1 in the firstdirection DR1. The area of the first region S1 may be substantiallyequal to the area of the second region S2. The first region S1 and thesecond region S2 may be substantially symmetrical with respect to thecenter line IL.

The upper bump area BPAU and the second substrate 200 may overlap eachother in the second direction DR2. The region where the upper bump areaBPAU overlaps with the second substrate 200 in the second direction DR2may include a third region S3 disposed on the other side of the centerline IL in the first direction DR1 and a fourth region S4 disposed onone side thereof in the first direction DR1.

The third region S3 and the fourth region S4 may be in contact with eachother. The third region S3 may be disposed on the other side of thefourth region S4 in the first direction DR1, and the fourth region S4may be disposed on one side of the third region S3 in the firstdirection DR1. For example, one side of the third region S3 in the firstdirection DR1 may form the other side of the fourth region S4 in thefirst direction DR1, and the other side of the fourth region S4 in thefirst direction DR1 may form one side of the third area S3 in the firstdirection DR1. The area of the third region S3 may be substantiallyequal to the area of the fourth region S4. The third region S3 and thefourth region S4 may be substantially symmetrical with respect to thecenter line IL. In addition, the shape of the upper bumps BPU disposedin the upper bump area BPAU may be substantially symmetrical withrespect to the center line IL. It is, however, to be understood that theexemplary embodiments are not limited thereto.

In the display device 1 flexible circuit boards 400_1 are attached tothe side surface of the curved display panel DP, so that the bezel canbe reduced significantly. When one side and the other side of the upperbump area BPAU in the third direction DR3 which are included in theflexible circuit board 400 are generally parallel to the edge of theside surface of the curved display panel DP, the curved display panel DPand the flexible circuit boards 400 can be attached together reliably.

According to the exemplary embodiments, it is possible to significantlyreduce the bezel of a curved display device.

FIG. 11 is a flowchart for illustrating an exemplary embodiment of amethod for fabricating the display device according to principles of theinvention. FIGS. 12 to 14 are cross-sectional views for illustrating themethod of fabricating the display device according to the flowchart ofFIG. 11 .

Referring to FIG. 11 , the method of fabricating the display deviceaccording to some exemplary embodiments may include preparing acurvature jig (step S11), preparing a flat panel display (step S12),curving the flat panel display panel using the curvature jig (step S13),and attaching a flexible circuit board to the curved display panel (stepS14). Although it is desired that the method is carried out according tothe flowchart of FIG. 11 , S12 may be carried out prior to S11 asdesired.

Referring to FIGS. 11 and 12 , in the preparing the curvature jig S11,the curvature jig JIG may include a first jig JIG1 and a second jigJIG2. The first jig JIG1 may include a generally curved concave surface,and the second jig JIG2 may include a generally curved convex surface.

The concave surface of the first jig JIG1 may be located at the centerof the wide main surface of the first jig JIG1, and generally flatsurfaces may be located at the both ends of the concave surface in thefirst direction DR1. The concave surface of the first jig JIG1 may berecessed from the generally flat surfaces. The first jig JIG1 may have awholly concave surface, but the exemplary embodiments are not limitedthereto. It may have a hole formed in the generally concave surface.

The generally convex surface of the second jig JIG2 may be located atthe center of the wide main surface of the second jig JIG2, andgenerally flat surfaces may be located at the both ends of the convexsurface in the first direction DR1. The generally convex surface of thesecond jig JIG2 may protrude from the flat surfaces. The second jig JIG2may have a wholly convex surface, but the exemplary embodiments are notlimited thereto. It may have a hole formed in the generally convexsurface.

The generally concave surface of the first jig JIG1 and the generallyconvex surface of the second jig JIG2 may have complementary shapes toengage with each other. The curvature of the generally concave surfaceof the first jig JIG1 and the curvature of the generally convex surfaceof the second jig JIG2 may be determined in a variety of ways dependingon the curvature to be formed using the curvature jig JIG.

It is desired that the width of the flat panel display panel DPF appliedto the curvature jig may be smaller than the width of the concave regionof the first jig JIG1 and the width of the convex region of the secondjig JIG2.

When the generally concave surface of the first jig JIG1 is placedtoward the upper side in the third direction DR3 and the generallyconvex surface of the second jig JIG2 is placed toward the lower side inthe third direction DR3, the generally concave surface of the first jigJIG1 and the generally convex surface of the second jig JIG2 may engagewith each other.

Although the first jig JIG1 includes the generally concave surface andthe second jig JIG2 includes the generally convex surface in thedrawings, this is merely illustrative. The first jig JIG1 may include agenerally convex surface and the second jig JIG2 may include a generallyconcave surface. Although the first jig JIG1 is placed below the secondjig JIG2 in the drawings, this is merely illustrative. The second jigJIG2 may be placed below the first jig JIG1.

In the preparing the flat display panel S12, the display panel DPF mayinclude a first substrate 100F, a second substrate 200F, and aliquid-crystal layer and a sealant SLF interposed between the firstsubstrate 100F and the second substrate 200F. The sealant SLF may bedisposed along the edges of the first and second substrates 100F and200F to prevent leakage of the liquid-crystal layer disposed between thefirst and second substrates 100F and 200F. The flat panel display panelDPF may not be curved. The flat panel display panel DPF may have, but isnot limited to, a generally rectangular shape when viewed from the top.It may have a generally circular shape or other generally polygonalshape.

A flat connection pad may be disposed on a side surface of the flatpanel display panel DPF. Although FIG. 12 shows the flat panel displaypanel DPF in which flat connection pad areas 500AF are disposed on theside surface for convenience of illustration, the flat connection padsmay be arranged in each of the flat connection pad areas 500AF asdescribed above with reference to FIG. 8 .

The curving the flat panel display panel using the curvature jig S13 mayinclude placing the flat panel display panel DPF on the generallyconcave surface of the first jig JIG1, pressing the flat panel displaypanel DPF using the second jig JIG2, and fixing the curved display panelDP to the curvature jig JIG.

During the process of placing the flat panel display panel DPF on theconcave surface of the first jig JIG1, the flat panel display panel DPFmay be supported substantially by the generally flat surfaces on theboth ends of the generally concave surface of the first jig JIG1 in thefirst direction DR1. Accordingly, the flat panel display panel DPF maybe spaced apart from the generally concave surface in the thirddirection DR3.

Referring to FIG. 13 , compressing the flat panel display panel DPFusing the second jig JIG2 may include pressing down the upper surface ofthe flat display panel DPF placed on the first jig JIG1 with thegenerally convex surface of the second jig JIG2 in the third directionDR3. By pressing down the flat panel display panel DPF using the secondjig JIG2, the upper surface of the display panel DPF becomes curved, sothat a curved display panel DP can be produced. In doing so, the edge ofthe display panel DP may be located more to the inside than the edge ofthe generally concave surface of the first jig JIG1, and may be locatedmore to the inside than the edge of the generally convex surface of thesecond jig JIG2. It is, however, to be understood that the exemplaryembodiments are not limited thereto.

The lower surface of the second jig JIG2 and the upper surface of thefirst jig JIG1 may have substantially the same shape. Specifically, theupper surface of the second substrate 200 may be curved to conform tothe lower surface of the second jig JIG2. The lower surface of the firstsubstrate 100 may be curved to conform to the upper surface of the firstjig JIG1. It is, however, to be understood that the exemplaryembodiments are not limited thereto. The upper surface of the first jigJIG1 may be spaced apart from the lower surface of the second jig JIG2by the distance substantially equal to the thickness of the displaypanel DP.

As the display panel DP is curved, the array of the generally flatconnection pads disposed on the side surface of the display panel DP iscurved into the shape of the connection pads 500 shown in FIG. 8 . Thatis to say, the flat connection pad areas 500AF may be curved into theconnection pad areas 500A. The shape of each connection pads 500 maychange, but the exemplary embodiments are not limited thereto. The shapeof each connection pad 500 does not change, but only the arrangement ofthe connection pads 500 may change.

If the pressure applied to the curved display panel DPF using the secondjig JIG2 is removed, the curved display panel DPF may be restored to theflat panel display panel again. For this reason, the curvature jig hasto be fixed so that the display panel DP remains curved.

A fixing member may be used for fixing the curvature jig. The fixingmember may fix the first jig JIG1 and the second jig JIG2. Specifically,the first jig JIG1 and the second jig JIG2 may be fixed such that thedisplay between the upper surface of the first jig JIG1 and the lowersurface of the second jig JIG2 is maintained. By doing so, the distancebetween the upper surface of the first jig JIG1 and the lower surface ofthe second jig JIG2 can be maintained substantially equal to thethickness of the display panel DP.

The fixing member may be disposed across the first jig JIG1 and thesecond jig JIG2. For example, the fixing member may be disposed across aside surface of the first jig JIG1 and a side surface of the second jigJIG2, or across the lower surface of the first jig JIG1 and the uppersurface of the second jig JIG2. It is, however, to be understood thatthe exemplary embodiments are not limited thereto.

Referring to FIGS. 6, 11 and 14 , after curving the flat panel displaypanel using the curvature jig S13, attaching of the flexible circuitboards to the curved display panel S14 may be carried out. As describedabove, the flexible circuit boards 400 may be attached to the sidesurface of the curved display panel DP. By doing so, the flexiblecircuit boards 400 may be electrically connected to the display panelDP.

Specifically, the flexible circuit boards 400 may be attached to theconnection pads 500 of the display panel DP through the adhesive films600. For example, an upper bump BPU of the flexible circuit board 400and the display panel DP may be electrically connected by an outer leadbonding (OLB) using the adhesive film 600. The adhesive film 600 may bedisposed to cover the entire connection pad 500 of the display panel DP,but the exemplary embodiments are not limited thereto. A part of theconnection pad 500 of the display panel DP may be exposed.

According to the exemplary method of fabricating the display device 1,the flexible circuit boards 400 are attached to the side surface of thecurved display panel DP to significantly reduce the bezel of the displaydevice 1. When one side and the other side of the upper bump area BPAUin the third direction DR3 which are included in the flexible circuitboard 400 are generally parallel to the edge of the side surface of thecurved display panel DP, the curved display panel DP and the flexiblecircuit boards 400 can be attached together reliably.

FIG. 15 is an enlarged view of another exemplary embodiment of the areaof a display panel with an attached flexible circuit board constructedaccording to principles of the invention. Features similar to thosedescribed above with reference to FIGS. 1 to 10 will be omitted to avoidredundancy.

The exemplary embodiment of FIG. 15 is different from the exemplaryembodiment of FIGS. 9 and 10 in that the shape of a flexible circuitboard 400_1 overlapping a display panel DP_1 in the second direction DR2is different.

A left side 420_1 of the flexible circuit board 400_1 may include afirst left side 421_1 overlapping a side surface of the display panelDP_1, and a second left side 422_1 non-overlapping the side surface ofthe display panel DP_1. A right side 430_1 of the flexible circuit board400_1 may include a first right side 431_1 overlapping the side surfaceof the display panel DP_1 and a second right side 432_1 non-overlappingthe side surface of the display panel DP_1. The first left side 421_1 ofthe flexible circuit board 400_1 faces a center of curvature COC_1 ofthe display panel DP_1 and may be generally perpendicular to an upperside 210_1 of a second substrate 200_1. The first right side 431_1 ofthe flexible circuit board 400_1 faces the center of curvature COC_1 ofthe display panel DP_1 and may be generally perpendicular to the upperside 210_1 of the second substrate 200_1. The spacing between the firstleft side 421_1 and the first right side 431_1 of the flexible circuitboard 400_1 may decrease toward the center of curvature COC_1 of thesecond substrate 200_1. It is, however, to be understood that theexemplary embodiments are not limited thereto.

In addition, an upper side 410_1 of the flexible circuit board 400_1 (orone edge in the third direction DR3) may have a curved shape. Thespacing distance between the upper side 410_1 of the flexible circuitboard 400_1 and the upper side 210_1 of the second substrate 200_1 maybe substantially constant across different regions. Therefore, thetangent line of the upper side 210_1 of the flexible circuit board 400_1at the point where the upper side 210_1 of the flexible circuit board400_1 intersects the first left side 421_1 may be generallyperpendicular to the first left side 421_1. The tangent line of theupper side 210_1 of the flexible circuit board 400_1 at the point wherethe upper side 210_1 of the flexible circuit board 400_1 intersects thefirst right side 431_1 may be generally perpendicular to the first rightside 431_1.

In the display device 1_1 according to the exemplary embodiments, aflexible circuit board 400_1 is attached to the side surface of thecurved display panel DP_1, so that the bezel can be reducedsignificantly. When one side and the other side of the upper bump areaBPAU_1 in the third direction DR3 which are included in the flexiblecircuit board 400_1 are generally parallel to the edge of the sidesurface of the curved display panel DP_1, the curved display panel DP_1and the flexible circuit boards 400_1 can be attached together reliably.

According to the exemplary embodiments, it is possible to significantlyreduce the bezel of a curved display device.

FIG. 16 is an enlarged view of a further exemplary embodiment of thearea of a display panel with an attached flexible circuit boardconstructed according to principles of the invention constructedaccording to principles of the invention.

The exemplary embodiment of FIG. 16 is generally different from theexemplary embodiment of FIGS. 9 and 10 in that the shape of a flexiblecircuit board 400_2 overlapping a display panel DP_2 in the seconddirection DR2 is different.

A left side 420_2 of the flexible circuit board 400_2 may include afirst left side 421_2 overlapping a side surface of the display panelDP_2, and a second left side 422_2 non-overlapping the side surface ofthe display panel DP_2. A right side 430_2 of the flexible circuit board400_2 may include a first right side 431_2 overlapping the side surfaceof the display panel DP_2 and a second right side 432_2 non-overlappingthe side surface of the display panel DP_2. The imaginary line extendingalong the first left side 421_2 of the flexible circuit board 400_2faces a center of curvature COC_2 of the display panel DP_2 and may beperpendicular to an upper side 210_2 of a second substrate 200_2. Theimaginary line extending along the first left side 431_2 of the flexiblecircuit board 400_2 faces the center of curvature COC_2 of the displaypanel DP_2 and may be generally perpendicular to the upper side 210_2 ofthe second substrate 200_2.

The upper side 410_2 of the flexible circuit board 400_2 may extend inthe first direction DR1 and may be perpendicular to a center line IL_2.The exemplary embodiment of FIG. 16 is different from the exemplaryembodiment of FIG. 15 in that the shape of the upper side 410_2 of theflexible circuit board 400_2 is a straight line rather than a curve.

In the display device 1_2 according to the exemplary embodiments, aflexible circuit board 400_2 is attached to the side surface of thecurved display panel DP_2, so that the bezel can be reducedsignificantly. When one side and the other side of the upper bump areaBPAU_2 in the third direction DR3 which are included in the flexiblecircuit board 400_2 are generally parallel to the edge of the sidesurface of the curved display panel DP_2, the curved display panel DP_2and the flexible circuit boards 400_2 can be attached together reliably.

According to the exemplary embodiments, it is possible to significantlyreduce the bezel of a curved display device.

FIG. 17 is an enlarged view of yet another exemplary embodiment of thearea of a display panel with an attached flexible circuit boardconstructed according to principles of the invention. FIG. 18 is a planview illustrating an exemplary embodiment of the upper bump area of theflexible circuit board of FIG. 17 .

The exemplary embodiment of FIGS. 17 and 18 is different from theexemplary embodiment of FIGS. 7 and 10 in that the shape of an upperbump area BPAU_3 overlapping a display panel DP_3 in the seconddirection DR2 is different.

A plurality of upper bumps BPU_3 disposed on a flexible circuit board400_3 may be arranged with the same curvature as the curvature of a sideedge of a second substrate 200_3. The length of an array ARR of theupper bumps BPU_3 in the thickness direction of the second substrate200_3 may be constant. The upper bump area BPAU_3 may be defined as thearea from one edge of the upper bump BPU_3 disposed at one end of thearray ARR of the upper bumps BPU to the opposite edge of the upper bumpBPU_3 disposed at the opposite end along the array ARR of the upperbumps BPU_3.

The upper bump area BPAU_3 may be surrounded by a first side BPAS1_3disposed on the upper side in the third direction DR3, a second sideBPAS2_3 disposed on the lower side in the third side DR3 from the firstside BPAS_3, a third side BPAS3_3 connecting the first side BPAS1_3 withthe second side BPAS2_3 on the other side in the first direction DR1,and a fourth side BPAS4_3 connecting the first side BPAS1_3 with thesecond side BPAS2_3 on the one side in the first direction DR1. Thespacing distance between the first side BPAS1_3 and the second sideBPAS2_3 may be substantially uniform across different regions. The firstside BPAS1_3 may be a line connecting the edges of the upper bumps BPU_3on the upper side in the third direction DR3. The second side BPAS2_3may be a line connecting the edges of the upper bumps BPU_3 on the lowerside in the third direction DR3. The third side BPAS3_3 may be the edgeof the outermost upper bump BPU_3 disposed on the other side in thefirst direction DR1. The fourth side BPAS4_3 may be the edge of theoutermost upper bump BPU_3 disposed on the one side in the firstdirection DR1. Although the first to fourth sides BPAS1 to BPAS4_3 arespaced apart from the sides of the upper bumps BPU in the example shownin FIG. 18 , this is merely illustrative.

The first and second sides BPAS1 and BPAS2_3 may be curved linesgenerally parallel to the display panel DP_3. For example, the first andsecond sides BPAS1 and BPAS2_3 may be equally spaced apart from the edgeof the side surface of each of the first substrate 100_3 and the secondsubstrate 200_3. The length of the first side BPAS1 may be substantiallyequal to the length of the second side BPAS2. It is, however, to beunderstood that the exemplary embodiments are not limited thereto.

According to some exemplary embodiments, the upper bumps BPU_3 each mayhave a generally rectangular shape and may extend in the same direction.In addition, one edge and the other edge of the upper bumps BPU_3included in the column of one upper bump BPU_3 may be aligned side byside in the third direction DR3. It is, however, to be understood thatthe exemplary embodiments are not limited thereto.

The tangent line of the first side BPAS1_3 at the point at which thefirst side BPAS1_3 of the upper bump area BPAU_3 intersects the centerline IL_3 may be generally perpendicular to the center line IL_3.Likewise, the tangent line of the second side BPAS2_3 at the point atwhich the second side BPAS2_3 intersects the center line IL_3 may begenerally perpendicular to the center line IL_3. It is, however, to beunderstood that the exemplary embodiments are not limited thereto.

The third side BPAS3_3 of the upper bump area BPAU_3 may be generallyparallel to each of the left side 420_3 and the right side 430_3 of theflexible circuit board 400_3. In addition, the fourth side BPAS4_3 ofthe upper bump area BPAU_3 may be generally parallel to each of the leftside 420_3 and the right side 430_3 of the flexible circuit board 400_3.It is, however, to be understood that the exemplary embodiments are notlimited thereto.

In the display device 1_3 according to the exemplary embodiments, aflexible circuit board 400_3 is attached to the side surface of thecurved display panel DP_3, so that the bezel can be reducedsignificantly. When one side and the other side of the upper bump areaBPAU_3 in the third direction DR3 which are included in the flexiblecircuit board 400_3 are generally parallel to the edge of the sidesurface of the curved display panel DP_3, the curved display panel DP_3and the flexible circuit boards 400_3 can be attached together reliably.

According to the exemplary embodiments, it is possible to significantlyreduce the bezel of a curved display device.

FIG. 19 is an enlarged view of still another exemplary embodiment thearea of a display panel with an attached flexible circuit boardconstructed according to principles of the invention.

The exemplary embodiment of FIG. 19 is different from the exemplaryembodiment of FIGS. 7 and 10 in that the shapes of an upper bump areaBPAU_4 and a flexible circuit board 400_4 overlapping a display panelDP_4 in the second direction DR2 is different.

The shape of the upper bump area BPAU_4 according to the exemplaryembodiments are identical to that described above with reference to FIG.17 . The upper side 410_4 of the flexible circuit board 400_4 (or theedge on the upper side in the third direction DR3) and the upper side210_4 of the second substrate 200_4 (or the edge on the upper side inthe third direction DR3) are arranged side by side.

In addition, the upper side 410_4 (or the edge on the upper side in thethird direction DR3) of the flexible circuit board 400_4 may begenerally parallel to the first and second sides BPAS1_4 and BPAS2_4 ofthe upper bump area BPAU_4.

In the display device 1_4 according to the exemplary embodiments, aflexible circuit board 400_4 is attached to the side surface of thecurved display panel DP_4, so that the bezel can be reducedsignificantly. When one side and the other side of the upper bump areaBPAU_4 in the third direction DR3 which are included in the flexiblecircuit board 400_4 are generally parallel to the edge of the sidesurface of the curved display panel DP_4, the curved display panel DP_4and the flexible circuit boards 400_4 can be attached together reliably.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A display device comprising: a curved firstsubstrate; a second substrate opposing the first substrate; a pluralityof connection pads disposed on a side surface of the first substrate anda side surface of the second substrate; and at least one flexiblecircuit board including a plurality of projections respectively coupledto the plurality of connection pads, wherein: the plurality ofprojections forms an array of projections along an edge of the sidesurface of the second substrate; the projections comprise bumpsextending in different directions; and angles defined by imaginary linesof adjacent ones of the bumps are substantially constant throughoutdifferent regions, wherein the imaginary lines extend in the directionsin which the respective bumps extend.
 2. The display device of claim 1,wherein the at least one flexible circuit board further comprises aprojection area defined as an area from an edge of a projection disposedat an end of the array of projections to an edge of a projectiondisposed at another end of the array of projections along the array ofprojections, wherein the projection area partially overlaps the sidesurface of the second substrate, wherein the overlapping area comprisesa first area disposed on one side of an imaginary center line and asecond area disposed on the other side of the imaginary center line, theimaginary center line substantially equally dividing the flexiblecircuit board and extending in a length direction of the flexiblecircuit board, and wherein the first area is substantially equal to thesecond area.
 3. The display device of claim 2, wherein the first areaand the second area have shapes that are substantially symmetrical withrespect to the imaginary center line.
 4. The display device of claim 2,wherein the projection area comprises a bump area and the projectionscomprise bumps disposed substantially symmetrically with respect to theimaginary center line in the array of the bumps.
 5. The display deviceof claim 2, wherein a spacing between an outer edge of the projectiondisposed at one end of the array of projections and an outer edge of theprojection disposed at the other end of the array of projections issubstantially uniform throughout different regions.
 6. The displaydevice of claim 1, further comprising adhesive films disposed betweenthe projections and the connection pads.
 7. The display device of claim6, wherein the adhesive films are disposed to cover the entireconnection pads.
 8. The display device of claim 1, wherein the array ofprojections has a substantially constant length in a thickness of thesecond substrate.
 9. The display device of claim 1, wherein a spacingbetween one edge and the other edge of the flexible circuit board in adirection of the array of projections is substantially uniformthroughout different regions.
 10. The display device of claim 1, whereinthe at least one flexible circuit board comprises a plurality offlexible circuit boards, and wherein the plurality of flexible circuitboards has a curvature substantially equal to a curvature of the edge ofthe side surface of the second substrate.
 11. The display device ofclaim 10, wherein a spacing between adjacent ones of the plurality offlexible circuit boards is substantially uniform.
 12. The display deviceof claim 1, wherein the plurality of projections forms the array ofprojections with substantially a same curvature.
 13. A display devicecomprising: a curved first substrate; a second substrate opposing thefirst substrate; a plurality of connection pads disposed on a sidesurface of the first substrate and a side surface of the secondsubstrate; and at least one flexible circuit board including a pluralityof projections respectively coupled to the plurality of connection pads,wherein: the plurality of projections forms an array of projectionsalong an edge of the side surface of the second substrate; the at leastone flexible circuit board further comprises a projection area definedas an area from an edge of a projection disposed at an end of the arrayof projections to an edge of a projection disposed at another end of thearray of projections along the array of projections; the projection areapartially overlaps the side surface of the second substrate; theoverlapping area comprises a first area disposed on one side of animaginary center line and a second area disposed on the other side ofthe imaginary center line, the imaginary center line substantiallyequally dividing the flexible circuit board and extending in a lengthdirection of the flexible circuit board; the first area is substantiallyequal to the second area; and a spacing between an outer edge of theprojection disposed at one end of the array of projections and an outeredge of the projection disposed at the other end of the array ofprojections decreases toward a center of curvature of the secondsubstrate.
 14. A display device comprising: a curved first substrate; asecond substrate opposing the first substrate; a plurality of connectionpads disposed on a side surface of the first substrate and a sidesurface of the second substrate; and at least one flexible circuit boardincluding a plurality of projections respectively coupled to theplurality of connection pads, wherein: the plurality of projectionsforms an array of projections along an edge of the side surface of thesecond substrate; and a spacing between edges of the flexible circuitboard in a direction of the array of projections decreases toward acenter of curvature of the second substrate in an area where the secondsubstrate overlaps with the flexible circuit board.